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Die Attach Film with Pressure Sensitive Dicing Tape ELEP MOUNT™ (EM Series)

Achieves high reliability by combining dicing and die attachment functions.

This adhesive film is for fixing IC chips to a lead frame or interposer in the semiconductor assembly process. It is useful in realizing high adhesive reliability and in BOC and stacked CSP manufacturing processes, solving conventional silver paste bleeding problems which cause short circuits. It has also been designed to enable use in a continuous process in combination with fixing tape for dicing.

Features

  • Outstanding pick-up performance with a 50µm thick chip.
  • Enables wafer mounting at 40°C (104°F).
  • Integrated with pressure-sensitive dicing tape.
  • Enables label shaping.

Structure

Properties

Chip sizeSurface
flatness
Line-upProperties
ThicknessWafer
size
[mm]
Supply form
C/C>2mm (78mil)FlatEM-500
(non-cure)
10-40 µm / 0.39-1.57 mil200
300
Precut/Non-precut
SmallFlatEM-310
(cure)
C/S-Rough

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TEL 1-800-755-8273

Business Hours (EST) 8:00 a.m.-5:30 p.m. Except for Sat, Sun, and Holidays

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Contact Us

Customer Support Center

TEL 1-800-755-8273
Business Hours (EST) 8:00 a.m.-5:30 p.m.
Except for Sat, Sun, and Holidays

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