Capable of releasing/collecting semiconductor wafers at any stage by constant support of the semiconductor wafer using a supporting wafer. Especially recommended for semiconductor wafer backgrind processing.
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| Product No. | NWS-Y5V | NWS-TS322F |
| Thickness | 111 μm / 4.37 mil | 148 μm / 5.82 mil |
| Adhesive strength of thermal release adhesive
(normal state)(to silicon) | 3.5 N/20mm / 15 oz/in | 1.7 N/20mm / 7.7 oz/in |
| Adhesive strength of thermal release adhesive
(after heat treatment) (to silicon) | 0.2 N/20mm (0.9 oz/in) or Less | 0.2 N/20mm (0.9 oz/in) or Less |
| Adhesive strength of pressure-sensitive adhesive
(to silicon) | 4.0 N/20mm / 18 oz/in | 1.5 N/20mm / 6.8 oz/in |
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TEL 1-800-755-8273
Business Hours (EST) 8:00 a.m.-5:30 p.m.
Except for Sat, Sun, and Holidays
