Room Temperature Curing Adhesive Usable at Very Low Temperatures SK-229
This two-part epoxy adhesive can be cured at room temperature, and is able to retain its adhesive strength at extremely low temperatures.
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Features
- Functional in a wide range of temperatures, from extremely low to room temperature.
- Excellent heat shock resistance
Properties
- Liquid A (blue) and Liquid B (yellow) combine for thixotropy.
- Once combined, the mixture is green.
| Category | Properties |
Viscosity | 1,000dpa•s
|
Mixture ratio | Liquid A:Liquid B = 1:1
|
Hardening
| 10-100 ℃
|
| 20℃x72hours |
| 100℃x20minutes |
| Sher adhesion | 16MPa [at. -196℃(77K)] |
Applications
- For fixing superconducting coils
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