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Double Sided Tape for Lead-free Soldering, Offering Excellent Heat-resistant and Repulsion Resistant Properties No.585

Ubstrate-included/heat-resistant double sided thin adhesive tape. Double sided adhesive tape with superior adhesion to applications with high repulsive force such as FPC bending.



  • Superior adhesiveness to applications with high repulsive force such as FPC bending.
  • High shard removal processability/usage during die-cutting process.
  • Can be soldered with the release liner attached. (heat resistant release liner)
  • Double release liner type is also available. (Product: No.585W)



180° peeling strength (to polyimide film)13 N/20mm/ 59 oz/in
Liner peeling strength0.9 N/ 50mm / 1.6 oz/in
Liner peeling strength after reflow1.3 N/ 50mm/ 2.4 oz/in


  • Note) Reflow condition: peak temp 250℃/ 482°F
  • * Measured by peeling in a 180° direction at a speed of 300 mm/min with 0.025 mm/ 0.98 mil PET lining.
  • * The figures are a sample of observed values, not guaranteed performance.


  • Fixing FPC to chassis, fixing reinforcement plates of FPC.
  • Other applications riring heat resistance.

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