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Southeast Asia

Solvent Resistance Dicing Tape(Under Development)

Dicing tape with solvent resistance is for special processes like TSV wafers.

TAIKO™ process and temporary carrier technology has been developed for very thin wafer processes in TSV (Trough-Silicon Via) wafers and IGBT. In these areas, solvent cleaning is necessary, but such very thin wafers cannot be handled without any support tapes. The solvent resistance dicing tape can support very thin wafers during the solvent cleaning process and it can be diced afterword.

Features

  • Excellent solvent resistance with excellent dicing performance.
  • Good pick up performance after solvent cleaning process.

Structure

Applications

  • Solvent wafer cleaning process on dicing tape after removing temporary carrier for TSV wafer and ultra thin wafer.

Contact Us

Customer Support Center

TEL +65-6879-3811 FAX +65-6274-7432

Business Hours(Singapore time)08:30 to 17:30 Except Sat, Sun & Public Holidays

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Contact Us

Customer Support Center

TEL +65-6879-3811
FAX +65-6274-7432
Business Hours(Singapore time)08:30 to 17:30
Except Sat, Sun & Public Holidays

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