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Room Temperature Curing Adhesive Usable at Very Low Temperatures SK-229

This two-part epoxy adhesive can be cured at room temperature, and is able to retain its adhesive strength at extremely low temperatures.

Features

  • Functional in a wide range of temperatures, from extremely low to room temperature.
  • Excellent heat shock resistance

Properties

  • Liquid A (blue) and Liquid B (yellow) combine for thixotropy.
  • Once combined, the mixture is green.
Category Properties
Viscosity
1,000dpa•s
Mixture ratio
Liquid A:Liquid B = 1:1
Hardening

10-100 ℃
20℃x24hours
100℃x20minutes
Sher adhesion 16MPa [at. -196℃(77K)]

Applications

  • For fixing superconducting coils

Contact Us

Customer Support Center

TEL +91-124-4221604 FAX +91-124-4221605

Business Hours(India time)08:30-17:00 Except for Second Sat of each month, Sun, and Holidays

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Contact Us

Customer Support Center

TEL +91-124-4221604
FAX +91-124-4221605
Business Hours(India time)08:30-17:00
Except for Second Sat of each month, Sun, and Holidays

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