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Die Attach Film with Pressure Sensitive Dicing Tape ELEP MOUNT™ (EM Series)

Achieves high reliability by combining dicing and die attachment functions.

This adhesive film is for fixing IC chips to a lead frame or interposer in the semiconductor assembly process. It is useful in realizing high adhesive reliability and in BOC and stacked CSP manufacturing processes, solving conventional silver paste bleeding problems which cause short circuits. It has also been designed to enable use in a continuous process in combination with fixing tape for dicing.

Features

  • Outstanding pick-up performance with a 50µm thick chip.
  • Enables wafer mounting at 40°C.
  • Integrated with pressure-sensitive dicing tape.
  • Enables label shaping.

Structure

Properties

Chip sizeSurface
flatness
Line-upProperties
Thickness
[µm]
Wafer
size
[mm]
Supply form
C/C>2mmFlatEM-700 series 
(non-cure)
10-40200
300
Precut/Non-precut
SmallFlatEM-310/400 series 
(cure)
C/S-Rough

Contact Us

TEL +32-89-360111

Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.

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Contact Us

TEL +32-89-360111

Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.

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