Nitto Denko Corporation (Nitto Denko) (Head Office: Osaka, Japan; President: Hideo Takasaki; hereinafter “Nitto”) today announced a joint development agreement with IBM to collaborate on advanced packaging technology and materials research. Through the agreement, researchers will work together to evaluate potential use cases for new classes of polymeric materials in advanced packaging processes.
In the semiconductor packaging field, the development of advanced packages for AI applications, such as chiplets, is gaining momentum. However, demands for higher wiring density for RDL interposer and larger package sizes have raised new issues such as package warpage and thermal expansion. This collaboration aims to address these challenges by evaluating new materials for improved thermo-mechanical reliability in semiconductor packaging.
"Nitto is pleased to collaborate with IBM Research for the advancement of materials research to develop next generation RDL technologies," said Yosuke Miki, Nitto's Director, Senior Executive Vice President, CTO, General Manager of Corporate Technology Sector. "Advances in materials have supported innovation in semiconductor devices and packaging technology. Through this collaboration, we hope to advance materials research for advanced packaging technologies to continue to meet the demands and challenges of AI."
"We are excited to be working with Nitto to advance materials research for advanced packaging," said Huiming Bu, Vice President, IBM Semiconductors Global R&D and Albany Operations, IBM Research. "IBM has been at the forefront of developing chiplet and advanced packaging technologies for the age of AI. This collaboration allows us to combine this expertise with Nitto’s strong background in materials development."
In addition to polymeric materials, the agreement also includes joint research on Nitto’s advanced packaging materials. The two companies are conducting a wide range of joint research and development, including applications for reducing thermal expansion and warpage of package substrates and technologies to reduce crosstalk noise between fine wiring.
