주 텍스트로 건너뛰기

한국

ELEP HOLDER ELP WS-02T

This tape is used for semiconductor wafer dicing process.

ELP WS-02T is UV curable adhesive tape. It supports the dicing process of semiconductor wafer manufacturing. Before UV curing, the tape holds the wafer firmly at dicing process. After UV curing, the tape releases die easily at diebonding process.

Structure

Feature

•Good adhesion stability in applied state (after lamination).
•Good pick-up ability and excellent chipping performance.
•Applicable for wide range die size.
•RoHSII complaint item

Standard Size

Thickness [mm] Width [mm] Length [m] Color
0.088 300,400 100 half transparent

Properties

Item Unit ELP WS-02T 
Thickness mm 0.087
Adhesive strength on Siwfer
Before UV
N/20mm
4.36
After UV
N/20mm
0.03
The above values are sample observed values, not the guaranteed performance.

연락처

영업시간 (한국시간) 09:00-17:00(토∙일 공휴일 제외)

Adobe Reader is required to view PDF files.
If not yet installed, please download it from the Adobe website.

Search by other product categories

연락처

영업시간 (한국시간)
09:00-17:00
토∙일 공휴일 제외

페이지 맨 위로 돌아가기