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Organic/Inorganic Hybrid Technology
Generally, while organic materials are outstanding
in terms of their processability, they are poor
conductors of heat and electricity and have a large
linear expansion coefficient. In order to overcome
such drawbacks they are normally mixed with inorganic
material to form composite materials.
Recently, however, there have been
calls for properties such as higher levels of thermal
conductivity and, in optical applications, calls
for higher refraction ratios and lower linear expansion
coefficients, properties that are just not possible
to achieve using simple organic/inorganic composite
materials. One way of solving this problem that
has become quite popular in research and development
is to use organic/inorganic hybrid technology to
design more advanced materials.
The use of this organic/inorganic hybrid
technology in its transparent optical semiconductor
encapsulating resin has helped Nitto Denko to lower
the linear expansion coefficient and increase reliability.
Transparent Optical Semiconductor Encapsulating Resin
As the purpose of this resin is to protect optical
semiconductors, transparency is essential. This
has ruled out the use of conventional inorganic
fillers, meaning that we were left with the problem
of how to reduce the high linear expansion coefficient.
We were able to overcome this problem
by using a composite metal oxide with a refractive
index and wavelength dispersion characteristics
that were the same as those of the resin to develop
a product that was both transparent and had a low
linear expansion coefficient.
Composite
resin containing inorganic filler is shown on the
left,
with a conventional product shown on
the right.
There is no obvious difference in transparency.
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