Adhesion Evaluation Technology

From use in general packaging application through to precision bonding in the field of electronics, adhesive tape plays an important role in a wide range of industrial applications. We have developed proprietary PSA tape evaluation methods that play an important role in the development of PSA tape to ensure that each type of tape will be optimally suited to its particular application.

The peel behavior observation device uses microscopes to capture the adhesive interface during peeling. By using glass or an acrylic board as an adherend and observing the adhesive interface from the front and from the side it is possible to accurately ascertain the peel behavior of adhesive tape and clarify the influence of the properties and structure of both the backing and adhesive.

Peel angle reliance in adhesive tape is reflected in the characteristics of the backing at high peel angles and the characteristics of the adhesive layer at low peel angles. By analyzing the results of these observations it is possible to form tape design indices for both the backing and adhesive layer.

The technology for simultaneously measuring the elasticity and viscosity of a material in a solid, molten or liquid state and analyzing the dynamic characteristics of the material properties is called rheology. By measuring temperature, frequency and time dependence, etc., it is possible to discover the modulus of elasticity, viscosity, glass transition temperature and softening point of that material. Using rheology it is possible to gain much insight into the properties of an adhesive tape, such as cold/heat resistance, compound resin compatibility and the degree of crosslinking in the adhesive, etc., data that is invaluable in the development of adhesive tape.