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Semiconductor Wafer Tape SWT 10TP+

Wafer processing tape designed for semiconductor pre-cut dicing processes.

SWT 10TP+ consists of a clear transparent PVC film coated with a pressure sensitive acrylic-based adhesive and is covered with a one-sided siliconised polyester liner. The tape is manufactured in clean room environment. The product is wound on a plastic core with the PVC film on the inside. Rolls are individually packed in a double polyethylene anti-static bag and foreseen with lot number.
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  • Excellent deformation behaviour
  • Excellent adhesion level
  • Easy unwind
  • Recyclable
  • Clean room product


  1. Clear transparent PVC film
  2. Pressure sensitive acrylic-based adhesive
  3. One-sided siliconised polyester liner


Adhesive type Acrylic-based
Film type PVC film
Total thickness 0.130 mm / 5.11 mil
Adhesion to SI-wafer 1.2 N/20 mm / 5.48 oz/in
Tensile strength MD 90 N/20 mm / 411 oz/in
Elongation MD 270%
Unwind force 0.6 N/20 mm / 2.7 oz/in
Color Transparent
Impurities content < 3 ppm


Nitto Semiconductor Wafer Tape SWT 10TP+ is an ideal product for processing semiconductor wafers, to be applied on the backside of the wafer (non-active side).

Contact Us

Customer Support Center

Business Hours (EST) 8:00 a.m.-5:30 p.m.(Except for Sat, Sun, and Holidays)

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