TAIKO® process and temporary carrier technology has been developed for very thin wafer processes in TSV (Trough-Silicon Via) wafers and IGBT. In these areas, solvent cleaning is necessary, but such very thin wafers cannot be handled without any support tapes. The solvent resistance dicing tape can support very thin wafers during the solvent cleaning process and it can be diced afterword.
This equipment is full-auto type Wafer Re-mounter for 300mm wafer, first removes the frame from wafer-mount-frame by support tape, and next mounts the wafer on the new frame by dicing tape, and removes the support tape from the wafer,
This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.