Contamination-less transferring (by using Twin arm Robot)
Stable peeling performance by Peeling bar, Peeling trigger, Edge keeper
(Peeling trigger & Edge keeper: Option)
Low stress peeling by partly peeling tape applying
Easy operation by Touch panel & Recipe function
Follow to CE mark / SEMI S2/S8
Adding SECS/GEM available
Applicable wafer size： 8 inch／6 inch
Applicable wafer thickness： TAIKOwafer：50um or more,
Normal wafer: 150um or more
Normal wafer： 50wafers/hr
*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
This equipemt is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.
This equipment removes protection tape from the wafer patterned surface after the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.