Middle East, Africa
Middle East, AfricaClick an application to see where products are used. Click on the yellow mark for details on the product.
A combination of dicing and die attachment functions make this a very reliable film.
This adhesive film is for fixing IC chips to lead frames, interposers, etc.
Offers excellent insulation and heat-resistant capabilities.
Prevents water and dust from penetrating the casing.
A porous film made of fluorine resin, offering water-resistance, water repellent, and weather resistant properties.
Hover mouse over image to show navigation
Customer Support Center
Business Hours(Turkey time)08:00-17:30(Except for Sat, Sun, and Holidays)
©NITTO DENKO CORPORATION. 2018 All rights reserved.
Go here to inquire about this application
