Pressure-sensitive dicing tape
A combination of dicing and die attachment functions make this a very reliable film.
Dicing and die attachment functions together as one
This adhesive film is for fixing IC chips to lead frames, interposers, etc.
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A combination of dicing and die attachment functions make this a very reliable film.
This adhesive film is for fixing IC chips to lead frames, interposers, etc.
Offers excellent insulation and heat-resistant capabilities.
Prevents water and dust from penetrating the casing.
A porous film made of fluorine resin, offering water-resistance, water repellent, and weather resistant properties.
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