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Middle East, Africa
Middle East, Africa

Dicing

Dicing Tape Line-up ELEP HOLDER®

Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing.

Die Attach Film with Pressure Sensitive Dicing Tape ELEP MOUNT® (EM Series)

Achieves high reliability by combining dicing and die attachment functions.

Solvent Resistance Dicing Tape(Under Development)

Dicing tape with solvent resistance is for special processes like TSV wafers.

Semiconductor Wafer Processing Tape SWT 20+R

Semiconductor wafer processing tape designed for excellent stability under various conditions of processing.

Semiconductor Wafer Processing Tape SWT 20T+R

Wafer processing tape designed for excellent stability under various conditions of processing.

Semiconductor Wafer Processing Tape SWT 10+R

Semiconductor wafer tape for dicing processes

Semiconductor Wafer Processing Tape SWT 10T+R

Wafer processing tape designed for semiconductor dicing processes.

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Business Hours(Turkey time)08:00-17:30(Except for Sat, Sun, and Holidays)

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