Offers low Young's modulus, small thermal expansion coefficient, excellent moisture-proofing, waterproofing, insulating, dust-proofing, and protective properties.
Features remarkable, reliable adhesion, quick film formation (3 to 15 minutes after application), strong elasticity, and anti-corrosion properties.
Features excellent flexibility, low water-vapor permeability, and hydrolysis resistance, along with a low Young's modulus, small thermal expansion coefficient, preventing temperature change so that substrates and chips are not influenced by stress.
In addition to the features offered by the LSS-520, the LSS-520MH offers improved heat-resistance, and uses solvent which does not apply to PRTR laws or Export Trade Control Ordinances, a feature long sought by customers to reduce a negative environmental impact.
Is a VOC free coating compound that uses water instead of organic solvent. Uses the same rubber base material as the LSS-520MH, maintaining high-level basic functions such as low elasticity, heat-resistance, and insulating properties.
Tensile speed 0mm/min
Tensile speed 300mm/min
Water-vapor perme ability
40℃ * 90%
3.1 * 10^16
3.3 * 10^16
2.4 * 10^16
Dry to touch
* Measurements provided here are measurement value examples and are not guaranteed.
ELEP COAT is a liquid sealing compound that uses rubber-modified material as its main ingredient.
When applied to the component side of a substrate, it thoroughly protects against moisture, dew, dust, and vibration.
In addition, this insulating, moisture-proof sealing compound results in very little stress on the components, and has no negative influence on the substrate such as cracks or leakage current.