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Southeast Asia


Backgrinding Tape Line-up ELEP HOLDER®

Low adhesion release and UV release. Outstanding characteristics support the backgrind process of wafer manufacturing.

Thermal Release Tape For Hard Substrate NWS-TS322F

Capable of processing brittle wafer.

Heat Resistance Back Grinding Tape(Under Development)

Back-grinding tape with heat resistance is for special heating process after wafer grinding.

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