Double Sided Tape for Fixing FPC with Heat-resistant Release Liner to Stiffeners, with Excellent Heat Resistance No.5919ML
Heat resistant double sided adhesive tape. No.5919ML is double coated adhesive tape for fixing of (*) FPC and stiffener or FPC and housings. The release liner and adhesive can withstand high temperature (peak at 260 degree c.) of the reflow soldering process.
Excellent heat resistance and bonding performance.
Release liner is also heat resistant, which can be used with release liner at soldering process.
Available in double release liner (PN:No.5919MLW)
180° peeling strength according to type of substrate
Stainless steel plate
Glass epoxy plate
* Backing: PET #25 Peeling speed: 300mm/min
Peeling angle: 180°
Measurement condition: 23℃ x 50 percent RH
180° peeling adhesion before and after IR reflow(soldering)
After IR reflow
Substrate:Stainless steel plate
Reflow peak temperature: 260℃
Measurement temperature: 23℃ x 50 percent RH
Peeling speed: 300mm/min
Substrate: phenol resin plate
Tape area: 10mmx20mm
Measurement condition: 40℃＆100℃ x an hour
* The data provided herein are not guaranteed values, but rather measurement values given as an example.
Fixing of FPC and stiffener
Fixing of FPC and Housing for Electronics equipment.
Fixing of compact cooling plate for electronics equipment.
* Nitto Denko does not guarantee that the tape can be used for the example applications provided herein. You should make sure the tape is suitable for the substrate by applying to some of the material prior to using for practical application
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