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Dicing

Dicing Tape Line-up ELEP HOLDER®

Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing.

Die Attach Film with Pressure Sensitive Dicing Tape ELEP MOUNT® (EM Series)

Achieves high reliability by combining dicing and die attachment functions.

Solvent Resistance Dicing Tape(Under Development)

Dicing tape with solvent resistance is for special processes like TSV wafers.

ELEP HOLDER_Dicing Tape V-8AR

V-8AR has an ideal adhesion level to keep the wafer on place during wafer dicing and shows a stable adhesion strength behavior on silicon wafer in function of time. 

The tape has an excellent deformation behavior and elongation to allow ideal stretching during wafer processing. 

Semiconductor Wafer Processing Tape SWT 10T+R

Wafer processing tape designed for semiconductor dicing processes.

Semiconductor Wafer Processing Tape SWT 20T+R

Wafer processing tape designed for excellent stability under various conditions of processing.

ELEP HOLDER_Dicing Tape V-8AR

V-8AR has an ideal adhesion level to keep the wafer on place during wafer dicing and shows a stable adhesion strength behavior on silicon wafer in function of time. 

The tape has an excellent deformation behavior and elongation to allow ideal stretching during wafer processing. 

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Business Hours(India time)08:30-17:00(Except for Second Sat of each month, Sun, and Holidays)

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