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Sealing Compound ELEP COAT LSS Series

This moisture-preventing liquid sealant thoroughly protects circuit boards from changes in humidity, temperature, and other environmental factors. ELEP COAT LSS Series.

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Except for Second Sat of each month, Sun, and Holidays

Features


It is and insulating / moistureproof coating material that protects the printed circuit board which is most important part of electronic equipment from harsh environments such as outdoor high temperature and high humidity.
  • Offers low Young's modulus, small thermal expansion coefficient, excellent moisture-proofing, waterproofing, insulating, dust-proofing, and protective properties.
  • Features remarkable, reliable adhesion, quick film formation (3 to 15 minutes after application), strong elasticity, and anti-corrosion properties.  

Properties

Item Unit LSS-520MH LSS-540E Measurement Conditions
Solid content % 25 40
Solution viscosity mPa ·s 400 12 25℃
Young's modulus MPa 75 9.2 Tensile speed 0mm/min
Elongation rate % 460 500 Tensile speed 300mm/min
Water-vapor perme ability g/cm²-day 0.002 0.0035 40℃ * 90%
Coating thickness:100µm
Volume resistivity Ω·cm 3.3 * 10^16 2.4 * 10^16 JIS C2107
Dry to touch min. 5 15 Coating thickness:20µm
[Extra Info]
  • * Measurements provided here are measurement value examples and are not guaranteed.

Applications

  • ELEP COAT is a liquid sealing compound that uses rubber-modified material as its main ingredient.
  • When applied to the component side of a substrate, it thoroughly protects against moisture, dew, dust, and vibration.
  • In addition, this insulating, moisture-proof sealing compound results in very little stress on the components, and has no negative influence on the substrate such as cracks or leakage current.

Contact Us

Customer Support Center

Business Hours(India time)08:30-17:00(Except for Second Sat of each month, Sun, and Holidays)

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