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Aluminum Substrate with Superior Heat Dissipation SL-AC Series

Aluminum board excellent in thermal dissipation, an alternative to glass epoxy circuit boards.

One of the key issues when designing more compact and high-performance electronic devices is "how much heat produced from chips can be dissipated". For this reason, printed circuit boards that effectively dissipates heat are demanded, and "metal boards" with good thermal conductivity came to attention and used as an alternative to conventional glass epoxy circuit boards. Nitto Shinko's aluminum boards are widely used for intelligent power module (IPM) board, which is a "power part" that converts commercial electrical current to direct current, then to variable voltage and frency, combined with the "drive control part" that controls motor speed.
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  • Excellent thermal conductivity.
  • Excellent solder dip resistance (330°C×2min or more).
  • Flame-retardant (UL-94VO certified).
  • Excellent voltage endurance.



Structure - SL-AC SL-AC(L) SL-AC-H SL-AC-H(L)
Copper Foil [μm] 35 105 70 105 70
Insulating Layer [μm] 80 125 100 125 150 125 150
Aluminum Thickness [μm] 1.0 2.0
Breakdown voltage [kV] 8.0 12.0 10.0 8.0 9.0 7.5 8.0
One-minute withstand voltage [kV] 5.5 9.0 6.5 7.0 4.5 5.0
Dielectric constant (1MHz) - 4.5 4.6 7.2 7.5
Thermal resistance C/W 0.52 0.80 0.48 0.55 0.65 0.35 0.43
Thermal conductivity W/mk 1.0 1.8 1.9 3.5


  • The above values are sample observed values, not the guaranteed performance .


  • For power module boards (power transistors, inverters, thyristors).
  • For switching power board.
  • For car electrical system board.
  • For LED board.

Contact Us

Customer Support Center

Business Hours(India time)08:30-17:00(Except for Second Sat of each month, Sun, and Holidays)

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