Skip to Main text



V-8AR has an ideal adhesion level to keep the wafer on place during wafer dicing and shows a stable adhesion strength behavior on silicon wafer in function of time. 

The tape has an excellent deformation behavior and elongation to allow ideal stretching during wafer processing. 

Contact Us

Business Hours (WET) 8:00h-17:00h

Except for Sat, Sun, and Holidays


  • Good adhesion stability in applied state (after taping).
  • Excellent pick-up ability and good chipping performance.
  • Tape has good expandability because of its PVC base film.
  • Low organic contamination (by Electron Spectroscopy Chemical Analysis).
  • Recommended chip size is 0.8mmsq – 5mmsq.


  • Nitto Semiconductor Wafer Tape, V-8AR is an ideal product for processing semiconductor wafers, to be applied on the backside of the wafer (non-active side). 


Property Unit ELP V-8AR
Thickness [µm] 75
Adhesion on mirror si-wafer [N/20mm] 1.2
Colour: Light Blue (Translucent)

Contact Us

Business Hours (WET) 8:00h-17:00h (Except for Sat, Sun, and Holidays)

Adobe Reader Download

Adobe Reader is required to view PDF files.
If not yet installed, please download it from the Adobe website.

Back to Page Top