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Vacuum Tape Mounter MV Series (Under Development)

The equipment is for laminating a dicing tape and NCF (Non-Conductive Film) including 2 in 1 type NCF in vacuum condition.

By introducing the technology of pre-cut tape handling / tape heating / vacuum mounting into a conventional Roll Tape Mounter, the equipment can laminate the dicing tape or NCF including 2 in 1 type NCF to wafers with uneven surfaces such as TSV wafers or bumped wafers.
Contact Us

Customer Support Center

  • TEL 1-800-755-8273

Business Hours (EST) 8:00 a.m.-5:30 p.m.

Except for Sat, Sun, and Holidays

Features

  • Lamination of thin and soft adhesive tape such as NCF including 2 in 1 type NCF is possible.
  • Air void free and flat lamination is possible by vacuum flat press technology.
  • 4 types of lamination methods are possible.
    1. Conventional dicing tape lamination.
    2. Two step lamination of NCF and dicing tape.
    3. Lamination of 2 in 1 type NCF (combining NCF and dicing tape).
    4. Lamination of 2 in 1 type die attach film (combining DAF and dicing tape).
  • 8 inch and 12 inch wafer

Applications

  • Tape lamination to TSV (Through-Silicon Via) wafer.
  • Tape lamination to bumped wafers such as FC-BGA etc.

Contact Us

Customer Support Center

Business Hours (EST) 8:00 a.m.-5:30 p.m.(Except for Sat, Sun, and Holidays)

  • TEL1-800-755-8273

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