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Die Attach Film with Pressure Sensitive Dicing Tape ELEP MOUNT® (EM Series)

Achieves high reliability by combining dicing and die attachment functions.

This adhesive film is for fixing IC chips to a lead frame or interposer in the semiconductor assembly process. It is useful in realizing high adhesive reliability and in BOC and stacked CSP manufacturing processes, solving conventional silver paste bleeding problems which cause short circuits. It has also been designed to enable use in a continuous process in combination with fixing tape for dicing.
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Business Hours (EST) 8:00 a.m.-5:30 p.m.

Except for Sat, Sun, and Holidays

Features

  • Outstanding pick-up performance with a 50µm thick chip.
  • Enables wafer mounting at 40°C (104°F).
  • Integrated with pressure-sensitive dicing tape.
  • Enables label shaping.

Structure

Properties

Chip size Surface
flatness
Line-up Properties
Thickness Wafer
size
[mm]
Supply form
C/C >2mm (78mil) Flat EM-500
(non-cure)
10-40 µm / 0.39-1.57 mil 200
300
Precut/Non-precut
Small Flat EM-310
(cure)
C/S - Rough

Contact Us

Customer Support Center

Business Hours (EST) 8:00 a.m.-5:30 p.m.(Except for Sat, Sun, and Holidays)

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