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Dicing

Dicing Tape Line-up ELEP HOLDER

Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing.

Die Attach Film with Pressure Sensitive Dicing Tape ELEP MOUNT® (EM Series)

Achieves high reliability by combining dicing and die attachment functions.

Wafer Mounter (Full-auto type) NEL SYSTEM®

This equipmet is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.

Wafer Mounter (Semi-auto type) NEL SYSTEM®

This equipmet is semi-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame.

Solvent Resistance Dicing Tape(Under Development)

Dicing tape with solvent resistance is for special processes like TSV wafers.

Wafer Level Non Conductive Film (With BG/T Type,With DC/T type) (WL-NCF) (Under Development)

The wafer level non conductive film (NCF) is a film type underfill material for flip chip mounting and TSV die stacking.

Electro Conductive Die Attach Film(Under Development)

Electro conductive die attach film is for bonding chips onto a leadframe that requires electro conductivity.

Vacuum Wafer Mounter NEL SYSTEM® series

This equipment is Wafrer Mounter in vacuum condition. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

Wafer Re-Mounter (MA3000III + Frame removal unit) NEL SYSTEM® series

This equipment is full-auto type Wafer Re-mounter for 300mm wafer, first removes the frame from wafer-mount-frame by support tape, and next mounts the wafer on the new frame by dicing tape, and removes the support tape from the wafer,

UV Irradiator for Dicing Process NEL SYSTEM® Series

This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

Semiconductor Wafer Tape SWT 20TP+

Wafer processing tape designed for for semiconductor pre-cut dicing processes.

Semiconductor Wafer Tape SWT 20T+

Wafer processing tape designed for excellent stability under various conditions of processing.

Semiconductor Wafer Tape SWT 20P+

Wafer processing tape designed for semiconductor pre-cut dicing processes.

Semiconductor Wafer Tape SWT 10TP+

Wafer processing tape designed for semiconductor pre-cut dicing processes.

Semiconductor Wafer Tape SWT 10T+

Wafer processing tape designed for semiconductor dicing processes.

Semiconductor Wafer Tape SWT 10P+

Wafer processing tape designed designed for semiconductor pre-cut dicing processes.

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