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Protection Tape Applicator (with Vacuum + Pressing function) NEL SYSTEM® series

This equipemt is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.

For the wafers having bumps or concave-convex, Tape applying performance can be significantly improved by using Vacuum mounting function & Mechanical pressing function.
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Customer Support Center

Business Hours (EST) 8:00 a.m.-5:30 p.m.

Except for Sat, Sun, and Holidays

DV3000semicon_backgrinding_img_icon_ce

Full auto Protection Tape Applicator for 300mm wafer (Vacuum applying + Pressing function)

Operation flow

Features

  • FOUP/Open cassette available
  • Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing
  • Easy operation by Touch panel & Recipe function
  • Log file function standard equipment
  • Follow to CE mark / SEMI S2/S8
  • Adding Wafer mapping scanner available
  • Adding SECS/GEM available

Basic spesifications

  • Applicable frame size: 300mm
  • Applicable wafer size: 300mm
  • Applicable wafer thickness: 775um
  • Throughput: 45wafers/hr.
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

Contact Us

Customer Support Center

Business Hours (EST) 8:00 a.m.-5:30 p.m.(Except for Sat, Sun, and Holidays)

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