Protection Tape Applicator (with Vacuum + Pressing function) NEL SYSTEM® series
This equipemt is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.
For the wafers having bumps or concave-convex,
Tape applying performance can be significantly improved by using Vacuum mounting function & Mechanical pressing function.
Full auto Protection Tape Applicator for 300mm wafer (Vacuum applying + Pressing function)
FOUP/Open cassette available
Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing
Easy operation by Touch panel & Recipe function
Log file function standard equipment
Follow to CE mark / SEMI S2/S8
Adding Wafer mapping scanner available
Adding SECS/GEM available
Applicable frame size： 300mm
Applicable wafer size： 300mm
Applicable wafer thickness： 775um
*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.