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Protection Tape Remover for Backgrinding Process NEL SYSTEM® Series

This equipment removes protection tape from the wafer patterned surface after the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

Contact Us

Customer Support Center

Business Hours (EST) 8:00 a.m.-5:30 p.m.

Except for Sat, Sun, and Holidays

HR3000IIIsemicon_backgrinding_img_icon_ce

Full-auto Tape Remover for 300mm wafer

Operation flow

Features

  • FOUP/Open cassette available
  • Stable peeling performance by Peeling Trigger
  • Low stress peeling by accurate control of Peeling bar
  • Easy operation by Touch panel & Recipe function
  • Log file function standard equipment
  • Follow to CE mark / SEMI S2/S8
  • Adding Wafer mapping scanner available
  • Adding SECS/GEM available

Basic spesifications

  • Applicable wafer size: 300mm/200mm
  • Applicable wafer thickness: 100um or more
  • Throughput: 60wafers/hr.
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

HR8500IIIsemicon_backgrinding_img_icon_ce

Full-auto Tape Remover for 200mm wafer

Operation flow

Features

  • 8""/6""/5"" wafer available
    4"" wafer handling (Option)
  • Table heating function
  • Thin wafer available (TW version)
  • Easy operation by Touch panel
  • Follow to CE mark
  • Adding SECS/GEM available

Basic spesifications

  • Applicable wafer size: 8/6/5/4 inch
  • Applicable wafer thickness: 250um or more、 TW version:150um or more
  • Throughput: 85wafers/hr. (TW version:68wafers/hr.)
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

HSA840semicon_backgrinding_img_icon_ce

Semi-auto Tape Remover for 200mm wafer

Operation flow

Features

  • 8""/6""/5""/4"" wafer available
  • 8""- 4"" wafer handling available by 1 table
  • Easy operation by Touch panel
  • Follow to CE mark / SEMI S2/S8"

Basic spesifications

  • Applicable wafer size: 8/6/5/4 inch
  • Applicable wafer thickness: 250um or more
  • Throughput: App.50sec./wafer
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

RHSA840IIsemicon_backgrinding_img_icon_ce

Semi-auto Tape Remover for 200mm wafer

Operation flow

Features

  • Peeling the protection tape from Wafer-mount-frame
  • 8"/6"/5"/4" wafer available
  • 8" frame available(6" frame: Option)
  • 8"- 4" wafer handling available by 1 table
  • Peeling protection tape from stand-alone wafer (Option)
  • Easy operation by Touch panel
  • Follow to CE mark & SEMI S2/S8

Basic spesifications

  • Applicable frame size: 8 inch, (6 inch: Option)
  • Applicable wafer size: 8/6/5/4 inch
  • Applicable wafer thickness: 100um or more、 250um or more(for stand-alone wafer)
  • Throughput: 50sec./wafer
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

Contact Us

Customer Support Center

Business Hours (EST) 8:00 a.m.-5:30 p.m.(Except for Sat, Sun, and Holidays)

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