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Heat Resistance Back Grinding Tape(Under Development)

Back-grinding tape with heat resistance is for special heating process after wafer grinding.

Heat resistance back grinding tape can correspond to the secondary process of wafer backside. After the back-grinding process, the wafers with the heat resistance back grinding tape can be processed (wet etching, ashing, metalizing, exposure/processing and so on).
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  • TEL 1-800-755-8273

Business Hours (EST) 8:00 a.m.-5:30 p.m.

Except for Sat, Sun, and Holidays


  • Excellent TTV (Total Thickness Variation) performance.
  • High heat resistance for the wafer backside process.
  • Easy peeling off from ground wafers after several kinds of wafer backside processes.



  • Wet etching or metalizing process of wafer backside of power devices, discrete devices, etc.
  • Complicated process in backside of wafer, like IGBT etc.
  • Other semiconductor processes which require a certain amount of heating.

Contact Us

Customer Support Center

Business Hours (EST) 8:00 a.m.-5:30 p.m.(Except for Sat, Sun, and Holidays)

  • TEL1-800-755-8273

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