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Low adhesion release and UV release. Outstanding characteristics support the backgrind process of wafer manufacturing.
Capable of processing brittle wafer.
Back-grinding tape with heat resistance is for special heating process after wafer grinding.
The wafer level non conductive film (NCF) is a film type underfill material for flip chip mounting and TSV die stacking.
This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.
This equipment removes protection tape from the wafer patterned surface after the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.
This equipemt is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.
This equipment is full-auto type Tape remover, removes protection tape (for back-grinding process) from TAIKO wafer patterned surface .
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Business Hours (EST) 8:00 a.m.-5:30 p.m.(Except for Sat, Sun, and Holidays)
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