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ELEP HOLDER ELP WS-01

This tape is used for semiconductor wafer dicing process.

ELP WS-01 is UV curable adhesive tape. It support for the dicing process of semiconductor wafer manufacturing. Before UV tape hold the wafer firmly at dicing process. After UV tape release die easily at diebonding process.
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Except for Sat, Sun, and Holidays

•Good adhesion stability in applied state (after taping).
•Good pick-up ability and excellent chipping performance.
•Applicable for wide range die size.
Thickness [mm] Width [mm] Length [m] Color
0.075 300,400 100 half transparent
*For other sizes, please contact us.
Item Unit ELP WS-01
Thickness mm 0.075
Adhesive strength on Siwfer
Before UV
N/20mm
7.00
After UV
N/20mm
0.10

Contact Us

Business Hours(Taiwan time)08:30-17:30(Except for Sat, Sun, and Holidays)

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