Skip to Main text

ELEP HOLDER_Dicing Tape V-8A

For semiconductor wafer dicing application. Has outstanding characteristics that support wafer dicing process.

Contact Us

Business Hours(Taiwan time)08:30-17:30

Except for Sat, Sun, and Holidays

Features

  • Good adhesion stability in applied state (after taping).
  • Excellent pick-up ability and good chipping performance.
  • Tape has good expandability because of its PVC base film.
  • Low organic contamination (by Electron Spectroscopy Chemical Analysis).
  • Recommended chip size is 0.8mmsq – 5mmsq.

Application

  • This tape is used for semiconductor wafer dicing process.

Properties

Property Unit ELP V-8A
Thickness [µm] 75
Adhesion on mirror si-wafer [N/20mm] 1.2
Colour: Light Blue (Translucent)

Contact Us

Business Hours(Taiwan time)08:30-17:30(Except for Sat, Sun, and Holidays)

Adobe Reader Download

Adobe Reader is required to view PDF files.
If not yet installed, please download it from the Adobe website.

Back to Page Top