The Electro conductive Die Attach Film is combined with dicing tape (2 in 1 structure). Electro conductivity is as high as conventional conductive paste. Because of the 2 in 1 structure, the electro conductive die attach film is attached when the dicing tape is laminated on a wafer so that it can reduce the customer’s processes. In addition, the electro conductive die attach film contributes to make the package smaller because the material does not bleed out from the chip edge after die bonding.
This equipment is full-auto type Wafer Re-mounter for 300mm wafer, first removes the frame from wafer-mount-frame by support tape, and next mounts the wafer on the new frame by dicing tape, and removes the support tape from the wafer,
This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.