Protection Tape Applicator (with Vacuum + Pressing function) NEL SYSTEM® series
This equipemt is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.
For the wafers having bumps or concave-convex,
Tape applying performance can be significantly improved by using Vacuum mounting function & Mechanical pressing function.
Full auto Protection Tape Applicator for 300mm wafer (Vacuum applying + Pressing function)
FOUP/Open cassette available
Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing
Easy operation by Touch panel & Recipe function
Log file function standard equipment
Follow to CE mark / SEMI S2/S8
Adding Wafer mapping scanner available
Adding SECS/GEM available
Applicable frame size： 300mm
Applicable wafer size： 300mm
Applicable wafer thickness： 775um
*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
This equipment removes protection tape from the wafer patterned surface after the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.