Wafer Level Non Conductive Film (With BG/T Type,With DC/T type) (WL-NCF) (Under Development)
The wafer level non conductive film (NCF) is a film type underfill material for flip chip mounting and TSV die stacking.
The wafer level NCF is suitable for flip chip mounting and TSV stacking with very narrow gaps and bump pitch. To reduce the customer’s processes, the wafer level NCF is combined with back-grinding tape or dicing tape (2 in 1 structure). Thin wafers can be safely handled without any damage because the NCF is laminated with wafer level.
This equipemt is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.
This equipment removes protection tape from the wafer patterned surface after the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.