Skip to Main text

Heat-resistant Low Adhesion Sheet PW(PROSS WELL) / TRM Series

Outstanding heat resistance can be used in various applications.

PW/TRM series are products which combines Nitto Denko's advanced adhesion controlled technology with heat resistant base materials and adhesives, and is applied in various electronic components and device processes. With the wide variety of outstanding heat resistant characteristics, PW/TRM series can be applied to temporary fixing and masking in heating processes, and can be used for protection and transport of film components. The adhesives can be chosen from acrylic-based adhesives and other silicon-based adhesives, suitable for heating applications, to meet customer needs.
Contact Us

Customer Support Center

Business Hours(Turkey time)08:00-17:30

Except for Sat, Sun, and Holidays

Features

  • Outstanding heat resistance.
  • Optimum for temporary fixing and masking in heating processes, and for protection and transport of film components.
  • Suitable adjustments can be made for processed products.

Strucuture

Specifications

PW Series

Product No. Adhesive Backing Total thickness (without liner) [μm] Release liner Adhesive strength [N/20mm]
PW-3610A Acrylic Polyimide #25 35 Polyester #50 0.35
[Remarks]
  • *Adherend: SUS plate, 2kg roller b , passes back and forth once, 5mm/sec, peeling speed 300mm/min, 180° angle

TRM Series

Product No. Adhesive Backing Total thickness [without liner] [μm] Release liner Adhesive strength [N/20mm]
TRM-3650S Silicone Polyimide film #25 31 Polyester film #50 0.3
TRM-6250L Silicone Polyimide film #25 31 Polyester film #50 0.5
[Remarks]
  • *Adherend: SUS plate, 2kg roller b, passes back and forth once, 5mm/sec, peeling speed 300mm/min, 180° angle

Applications

  • Carrier: Support for thin-layer materials and protection during transport
  • Temporary fixing: Temporary fixing manufacturing processes riring high-temperature
  • Masking: Masking for package manufacturing processes
  • Surface protection: Protection of CCD glass
  • Dam: Prevents resin leakage when molding semiconductor packages and electronic components

Cautions

  • Please avoid skin contact, as this could cause rashes.
  • Please refer to a certified disposal company for safe disposal. (Do not incinerate as this may produce toxic gas or odors that can cause nausea if inhaled.)

Contact Us

Customer Support Center

Business Hours(Turkey time)08:00-17:30(Except for Sat, Sun, and Holidays)

Back to Page Top