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Dicing

Semiconductor Wafer Tape SWT 10+R

Semiconductor wafer tape for dicing processes

Semiconductor Wafer Tape SWT 10P+

Wafer processing tape designed designed for semiconductor pre-cut dicing processes.

Semiconductor Wafer Tape SWT 10T+

Wafer processing tape designed for semiconductor dicing processes.

Semiconductor Wafer Tape SWT 10TP+

Wafer processing tape designed for semiconductor pre-cut dicing processes.

Semiconductor Wafer Tape SWT 20+R

Nitto Semiconductor Wafer Tape SWT20+R is a wafer processing tape designed for excellent stability under various conditions of processing.

Semiconductor Wafer Tape SWT 20P+

Wafer processing tape designed for semiconductor pre-cut dicing processes.

Semiconductor Wafer Tape SWT 20T+

Wafer processing tape designed for excellent stability under various conditions of processing.

Semiconductor Wafer Tape SWT 20TP+

Wafer processing tape designed for for semiconductor pre-cut dicing processes.

Die Attach Film with Pressure Sensitive Dicing Tape ELEP MOUNT® (EM Series)

Achieves high reliability by combining dicing and die attachment functions.

UV Irradiator for Dicing Process NEL SYSTEM® Series

This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

Wafer Mounter (Full-auto type) NEL SYSTEM®

This equipmet is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.

Wafer Mounter (Semi-auto type) NEL SYSTEM®

This equipmet is semi-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame.

Solvent Resistance Dicing Tape(Under Development)

Dicing tape with solvent resistance is for special processes like TSV wafers.

Wafer Level Non Conductive Film (With BG/T Type,With DC/T type) (WL-NCF) (Under Development)

The wafer level non conductive film (NCF) is a film type underfill material for flip chip mounting and TSV die stacking.

Electro Conductive Die Attach Film(Under Development)

Electro conductive die attach film is for bonding chips onto a leadframe that requires electro conductivity.

Vacuum Tape Mounter MV Series (Under Development)

The equipment is for laminating a dicing tape and NCF (Non-Conductive Film) including 2 in 1 type NCF in vacuum condition.

Vacuum Wafer Mounter NEL SYSTEM® series

This equipment is Wafrer Mounter in vacuum condition. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

Wafer Re-Mounter (MA3000III + Frame removal unit) NEL SYSTEM® series

This equipment is full-auto type Wafer Re-mounter for 300mm wafer, first removes the frame from wafer-mount-frame by support tape, and next mounts the wafer on the new frame by dicing tape, and removes the support tape from the wafer,

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