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Backgrinding

Back Grinding Tape Line-up ELEP HOLDER

Low adhesion release and UV release. Outstanding characteristics support the backgrind process of wafer manufacturing.

Heat Resistance Back Grinding Tape(Under Development)

Back-grinding tape with heat resistance is for special heating process after wafer grinding.

Wafer Level Non Conductive Film (With BG/T Type,With DC/T type) (WL-NCF) (Under Development)

The wafer level non conductive film (NCF) is a film type underfill material for flip chip mounting and TSV die stacking.

Protection Tape Applicator for Backgrinding Process NEL SYSTEM® Series

This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

Protection Tape Remover for Backgrinding Process NEL SYSTEM® Series

This equipment removes protection tape from the wafer patterned surface after the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

Protection Tape Applicator (with Vacuum + Pressing function) NEL SYSTEM® series

This equipemt is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.

Protection Tape Remover from TAIKO® Wafer NEL SYSTEM® series

This equipment is full-auto type Tape remover, removes protection tape (for back-grinding process) from TAIKO wafer patterned surface .

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