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Thermal Conduction Sheet with Superior Heat Dissipation and a Remarkable Cooling Effect in Electronic Devices
Thermal conduction sheet effective for heat dissipation and cooling of integrated circuit devices, etc.
Aluminum Substrate with Superior Heat Dissipation
Aluminum substrate with excellent heat dissipation, to be used in place of glass epoxy circuit boards.
Adhesive tape for heating pads to be applied directly to the skin.
Adhesive sheet with air and moisture permeability.
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