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ELEP HOLDER_Dicing Tape V-8A

For semiconductor wafer dicing application. Has outstanding characteristics that support wafer dicing process.

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Features

  • Good adhesion stability in applied state (after taping).
  • Excellent pick-up ability and good chipping performance.
  • Tape has good expandability because of its PVC base film.
  • Low organic contamination (by Electron Spectroscopy Chemical Analysis).
  • Recommended chip size is 0.8mmsq – 5mmsq.

Application

  • This tape is used for semiconductor wafer dicing process.

Properties

Property Unit ELP V-8A
Thickness [µm] 75
Adhesion on mirror si-wafer [N/20mm] 1.2
Colour: Light Blue (Translucent)

Contact Us

Customer Support Center

Business Hours(Singapore time)08:30 to 17:30 (Except Sat, Sun & Public Holidays)

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