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Semiconductor Wafer Tape SWT 10T+

Wafer processing tape designed for semiconductor dicing processes.

SWT 10T+ consists of a clear transparent PVC film coated with a pressure sensitive acrylicbased adhesive manufactured in clean room environment. For easy unwind, the backing of the PVC-film is coated with a silicone release. The product is wound on a plastic core. Rolls are individually packed in a double polyethylene anti-static bag and foreseen with lot number.
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Features

  • Excellent deformation behaviour
  • Excellent adhesion level
  • Easy unwind
  • Recyclable
  • Clean room product

Structure

  1. Unique blue transparent PVC film
  2. Pressure sensitive acrylic-based adhesive
  3. One-sided siliconised polyester liner

Properties

Adhesive type Acrylic-based
Film type PVC film
Total thickness 0.128 mm
Adhesion to SI-wafer 1.2 N/20 mm
Tensile strength MD 90 N/20 mm
Elongation MD 270%
Unwind force 0.6 N/20 mm
Color Transparent
Impurities content < 3 ppm

Application

Nitto Semiconductor Wafer Tape SWT 10T+ is an ideal product for processing semiconductor wafers, to be applied on the backside of the wafer (non-active side).

Contact Us

Customer Support Center

Business Hours(Singapore time)08:30 to 17:30 (Except Sat, Sun & Public Holidays)

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