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Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing.
Achieves high reliability by combining dicing and die attachment functions.
This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.
This equipmet is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.
This equipmet is semi-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame.
Dicing tape with solvent resistance is for special processes like TSV wafers.
The wafer level non conductive film (NCF) is a film type underfill material for flip chip mounting and TSV die stacking.
Electro conductive die attach film is for bonding chips onto a leadframe that requires electro conductivity.
This equipment is Wafrer Mounter in vacuum condition. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.
This equipment is full-auto type Wafer Re-mounter for 300mm wafer, first removes the frame from wafer-mount-frame by support tape, and next mounts the wafer on the new frame by dicing tape, and removes the support tape from the wafer,
For semiconductor wafer dicing application. Has outstanding characteristics that support wafer dicing process.
This tape is used for semiconductor wafer dicing process.
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