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Sealing Compound ELEP COAT LSS Series

This moisture-preventing liquid sealant thoroughly protects circuit boards from changes in humidity, temperature, and other environmental factors. ELEP COAT LSS Series.

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Business Hours(Singapore time)08:30 to 17:30

Except Sat, Sun & Public Holidays


  • Offers low Young's modulus, small thermal expansion coefficient, excellent moisture-proofing, waterproofing, insulating, dust-proofing, and protective properties. 
  •  Features remarkable, reliable adhesion, quick film formation (3 to 15 minutes after application), strong elasticity, and anti-corrosion properties. 

  1. LSS-520

    Features excellent flexibility, low water-vapor permeability, and hydrolysis resistance, along with a low Young's modulus, small thermal expansion coefficient, preventing temperature change so that substrates and chips are not influenced by stress.  

  2. LSS-520MH 

    In addition to the features offered by the LSS-520, the LSS-520MH offers improved heat-resistance, and uses solvent which does not apply to PRTR laws or Export Trade Control Ordinances, a feature long sought by customers to reduce a negative environmental impact. 

  3. LSS-540E

    Is a VOC free coating compound that uses water instead of organic solvent.  Uses the same rubber base material as the LSS-520MH, maintaining high-level basic functions such as low elasticity, heat-resistance, and insulating properties.


Item Unit LSS-520 LSS-520MH LSS-540E Measurement Conditions
Solid content % 30 25 40
Solution viscosity mPa ·s 400 400 12 25℃
Young's modulus MPa 86 75 9.2 Tensile speed 0mm/min
Elongation rate % 450 460 500 Tensile speed 300mm/min
Water-vapor perme ability g/cm²-day 0.002 0.002 0.0035 40℃ * 90%
Coating thickness:100µm
Volume resistivity Ω·cm 3.1 * 10^16 3.3 * 10^16 2.4 * 10^16 JIS C2107
Dry to touch min. 3 5 15 Coating thickness:20µm
[Extra Info]
  • * Measurements provided here are measurement value examples and are not guaranteed.


  • ELEP COAT is a liquid sealing compound that uses rubber-modified material as its main ingredient.
  • When applied to the component side of a substrate, it thoroughly protects against moisture, dew, dust, and vibration.
  • In addition, this insulating, moisture-proof sealing compound results in very little stress on the components, and has no negative influence on the substrate such as cracks or leakage current.

Contact Us

Customer Support Center

Business Hours(Singapore time)08:30 to 17:30 (Except Sat, Sun & Public Holidays)

  • TEL +65-6879-3811
  • FAX +65-6274-7432
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