* Measured by peeling in a 180° direction at a speed of 300 mm/min at 23℃ with 0.025 mm PET lining.
* These values are only examples of observed samples and not a guarantee of performance.
*1 Laser flash method At 23°C
For fixing LED base board and housing.
For fixing CPU and heat sink or radiation fin.
For fixing various types of semiconductor package and heat sink.
For fixing electronic parts and heat sink.
Make sure to remove any oils, moisture, dust, etc. from the substrate.
As this is a pressure-sensitive adhesive, make sure to thoroughly use a roller or press for crimping. If crimping is not performed thoroughly enough, its properties and external view may be negatively affected.
Clean adhesion may not occur if a surface is highly irregular or warped. Smooth it out as much as possible.
It takes a little time for the tape's original adhesive strength to take full effect, so avoid placing or using the tape in a situation in which a lot of strength is needed until several hours have passed from the time of attachment.
Make sure to store this product in a box.
Avoid storing in high-temperature or high-moisture areas. This product should be stored in a cool, dark area away from direct sunlight (at a temperature of no more than 25℃).
Please use this tape within 6 months of storage.
Take a careful consideration if this product is adapted to the use, purpose and condition before using. The tape may peel in some cases depending on substrate and attachment conditions.
When using this product in areas that may pose a risk of accident, use together with a different joining method.
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