Current Density Analysis

Design is an integral part of optimizing plating baths to ensure even plating thickness.

When plating a material, variations in plating thickness may occur, as current density is concentrated on the edges of the material. In order to solve this problem, current density analysis is carried out, which allows the structure of the plating bath to be optimized (electrode, material, closure plate position and dimensions and distance from each other, etc.) to ensure an even plating thickness.

Electromagnetic Field Analysis

Simulation technology plays an important role in the analysis of electromagnetic fields when FPCs are bent and in circuit design using differential transmission methods.

High Frequency Electromagnetic Field Analysis

One of the major characteristics of FPCs is their flexibility, which allows them to be mounted when bent or folded and which in turn helps to save space in devices. Analyzing the electromagnetic field when FPCs are bent is helpful in discovering the degree to which they are affected when it is bent and in formulating countermeasures. By analyzing the electromagnetic field strength distribution it is also possible to formulate measures for electromagnetic compatibility (EMC).

Thermal Conductivity Analysis

Thermal conductivity analysis is an essential tool in the design of packages with outstanding heat dissipation characteristics.

With the miniaturization of electronic devices there have come calls for thinner, higher density circuit boards to be used in them. At the same time, there are demands for solutions to be found to the problem of the increased levels of heat that chips are now generating. Thermal conductivity analysis is used to design circuit boards and packages with outstanding heat dissipation characteristics.