Adhesion Evaluation Technology

PSA tape plays an important role in a wide range of fields from use in general packaging through to precision machinery.
This technology supports development and improves reliability.

From use in general packaging application through to precision bonding in the field of electronics, adhesive tape plays an important role in a wide range of industrial applications. We have developed proprietary PSA tape evaluation methods that play an important role in the development of PSA tape to ensure that each type of tape will be optimally suited to its particular application.

Pressure sensitive adhesive tape structure

Pressure sensitive adhesive tape composition.

Peel Behavior Evaluation
Adhesion Evaluation
Viscoelasticity Evaluation
Die Cutting Characteristic Evaluation

Peel Behavior Evaluation

Observing the behavior of adhesive tape during peeling.

The peel behavior observation device uses microscopes to capture the adhesive interface during peeling. By using glass or an acrylic board as an adherend and observing the adhesive interface from the front and from the side it is possible to accurately ascertain the peel behavior of adhesive tape and clarify the influence of the properties and structure of both the backing and adhesive.

Peel behavior observation device overview

Observation of the “serrated” adhesive interface from the front during peeling.

Observation of the peel mechanism from the side.

Adhesion Evaluation

Measuring the adhesion of adhesive tape from a wide range of peel angles.

Peel angle reliance in adhesive tape is reflected in the characteristics of the backing at high peel angles and the characteristics of the adhesive layer at low peel angles. By analyzing the results of these observations it is possible to form tape design indices for both the backing and adhesive layer.

Variable angle peel measurement device operation

It is possible to measure adhesion at a certain peel angle at a designated peel speed.

Adhesive tape peel angle reliance

Peel strength varies according to the thickness of the backing undergoing viscoelastic evaluation.

Viscoelasticity Evaluation

The accurate evaluation of the viscoelasticity of adhesive tape in terms of temperature and frequency dependence is essential in the development of pressure sensitive adhesive tape.

Adhesive Rheology

The technology for simultaneously measuring the elasticity and viscosity of a material in a solid, molten or liquid state and analyzing the dynamic characteristics of the material properties is called rheology. By measuring temperature, frequency and time dependence, etc., it is possible to discover the modulus of elasticity, viscosity, glass transition temperature and softening point of that material. Using rheology it is possible to gain much insight into the properties of an adhesive tape, such as cold/heat resistance, compound resin compatibility and the degree of crosslinking in the adhesive, etc., data that is invaluable in the development of adhesive tape.

Measuring Principle

Varying degrees of speed and torque (rotation) are input at the bottom of the device, transferred through the sample and recorded by the torque sensor at the top.

Temperature dependent spectrum example

G': shear storage modulus: The shear storage modulus G’ in temperature dispersion monitoring, for example, shows the hardness of the adhesive and the usable range of the tape, which is called the rubber plateau.
tanδ: loss tangent: It is possible to observe differences in the attenuation characteristics of adhesives. If tanδ is high, the greater the range, the higher the vibration damping effect over a wider temperature range.

Die Cutting Characteristic Evaluation

Observing behavior and measuring cutting resistance at the time of cutting in order to achieve more precise die cutting.

Precision die cutting is required for processing double-coated tape, etc., into a predetermined shape before supplying it to customers. In our die cutting characteristic evaluation system, a high-speed camera with a zoom lens makes it possible to observe the high speed and complex cutting of multi-layer film. Cutting resistance is measured at the time of cutting using a high-sensitivity load cell. Using this type of observation and measurement it is possible to analyze the causes of failures that occur during cutting. In addition to being used for double-coated tape, this technology is also being developed for use with polarizing film and FPCs.