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Flexible Printed Circuits
A Flexible Circuit for Smaller and Lighter Devices
The Flexible Printed Circuit <NITOFLEX> contributes greatly to lighter and more compact home appliances, OA equipment, and communication devices. An intricate circuit is formed on top of flexible insulating film, and can be used in cell phones, PCs, and VCRs. In addition, double-coated adhesive tapes, heat-activated adhesive sheets, and surface protective materials are used in the fixing of reinforcement panels for FPCs, and thin-film metal circuit boards are used in HDDs as high resolution circuit technology is realized.
Flexible Printed Circuits
High Density and Precision Flexible Printed Circuit "NITOFLEX®"
Super-fine features created from a combination of circuit production technology and designing technology! We will meet the line pitch requirement by utilizing these two processing technologies.
Super-fine features created from a combination of circuit production technology and designing technology! We will meet the line pitch requirement by utilizing these two processing technologies.
Environmental Harmony Type Halogen-free FPC "NITOFLEX®"
An environmentally-friendly halogen free FPC attaining high grade of flame-resistance (under UL94VTM-O) without the use of halogens or antimony as the flame retardant.
An environmentally-friendly halogen free FPC attaining high grade of flame-resistance (under UL94VTM-O) without the use of halogens or antimony as the flame retardant.
Ultra-thin Double-sided FPC "NITOFLEX®"
A Circuit Board which Reduces the Bias Force with a Thin Base Pl to Combine Improved Flexibility with Double-sided Micro Line Processing.
A Circuit Board which Reduces the Bias Force with a Thin Base Pl to Combine Improved Flexibility with Double-sided Micro Line Processing.
"CARRIERFLEX®"
High cumulative dimensional precision is realized with a new process using metal reinforcement.
High cumulative dimensional precision is realized with a new process using metal reinforcement.
Thin-film Metal Base Board with High Resolution Circuit "CISFLEX"
Forms a High Resolution Circuit with Photosensitive Pl and Semi-additive Copper Plating on a Metal Base.
Forms a High Resolution Circuit with Photosensitive Pl and Semi-additive Copper Plating on a Metal Base.
Double-coated Adhesive Tape
Substrate-included/Heat-resistant Double-coated Thin Adhesive Tape No.585
Double-coated Adhesive Tape with Superior Adhesion to Applications with High Repulsive Force such as FPC Bending.
Double-coated Adhesive Tape with Superior Adhesion to Applications with High Repulsive Force such as FPC Bending.
Heat Resistant Double-coated Adhesive Tape No.5915
No.5915 double-coated adhesive tape provides superior heat resistance, adhesive strength, and chemical resistance. Because there is almost no volatilization from the adhesive, the tape can be used in the electrical and electronics fields that require soldering and washing with chemicals after the tape is applied. With its superior processability, the transfer tape is easy to process and can be used for fine processing.
No.5915 double-coated adhesive tape provides superior heat resistance, adhesive strength, and chemical resistance. Because there is almost no volatilization from the adhesive, the tape can be used in the electrical and electronics fields that require soldering and washing with chemicals after the tape is applied. With its superior processability, the transfer tape is easy to process and can be used for fine processing.
No.5919ML
No.5919ML is double coated adhesive tape for fixing of (*) FPC and stiffener or FPC and housings. The release liner and adhesive can withstand high temperature (peak at 260 degree C.) of the reflow soldering process.
No.5919ML is double coated adhesive tape for fixing of (*) FPC and stiffener or FPC and housings. The release liner and adhesive can withstand high temperature (peak at 260 degree C.) of the reflow soldering process.
Surface Protective Material
Surface Protection Material for Electronic Devices
Masking/Surface protection material developed for leading-edge electronics and optical fields.
Masking/Surface protection material developed for leading-edge electronics and optical fields.
