ECU
Recently, the electronic control of vehicle parts has been steadily increasing and the ECU plays a key role in this. Our masking tape for printed-circuit boards can be used during the manufacturing process. Also, quantities and processes can be managed with the label printing system. The semiconductor chip is protected from heat by the semiconductor encapsulating resin. The board surface can be protected from moisture, dust, and impact with the liquid insulation vapor retardant sealing material. The casing can be sealed with the high performance sealing material <EPT SEALER> and <SEAL-SAVER>, and its internal pressure can be regulated easily and reliably with the film TEMISH®.
High Performance Sealing Material
Sealing Material EPT SEALERFill gaps to shut out heat, water, sound, or vibrations. High-function sealing material of EPDM rubber foam.
Semiconductor Encapsulating Epoxy Resin
On-site Label Printing System
Nitto Denko provides a wide range of packaged on-site label printing systems from general purposes to use in specific environments. <DURA SYSTEM> was developed as a total label printing system encompassing everything from supply products such as labels and ink ribbons to printers, application software, and automatic label applicators. Various on-site label printing needs can be handled within packaged systems, from such general display purposes as nameplate labels to barcode management purposes in various FA fields such as printed-circuit board mountings exposed to harsh environments.
DURATACK PPolyimide label mainly used in soldering process in manufacturing printed circuit boards.
High Performance Water/Dust-proof Ventilation Material