Semiconductor Products

Wafer Process

• Cleaning Wafer®

Backgrinding

• ELEP HOLDER® Back Grinding Tape Line-up
• Thermal Release Tape For Hard Substrate NWS-Y5V/NWS-TS322F
• Heat Resistance Back Grinding Tape
• Wafer Level Non Conductive Film (WL-NCF)(with Back Grinding Tape)
• Protection Tape Applicator for Backgrinding Process NEL SYSTEM® Series
• Protection Tape Remover for Backgrinding Process NEL SYSTEM®
• Vacuum Tape Applicator with Press System(DV series)
• Wafer Protection Tape Remover for TAIKO® Wafer(HR8500ⅢTW / for TAIKO® Wafer)

Dicing

• ELEP HOLDER® Dicing Tape Line-up
• ELEP MOUNT® （EM Series）
• Tape Applicator for Dicing Process NEL SYSTEM®
• UV Irradiator for Dicing Process NEL SYSTEM® Series
• Solvent Resistance Dicing Tape
• Wafer Level Non Conductive Film (WL-NCF)(with Dicing Tape)
• Electro Conductive Die Attach Film
• Vacuum Tape Mounter(MV series)
• Vacuum Tape Mounter (for TAIKO® wafer)
• Wafer Re-mounter (MA3000III + Frame Removal section)

Molding

• Heat-resistant Peelable Adhesive Tapes PROSS-WELL/TRM
• TRM Applicator NEL SYSTEM®　PL-55TRM

■ Semiconductor sealing resin

• Thermosetting Epoxy Molding Sheet
• Molding machine for Thermosetting Epoxy molding Sheet(TL series)

■ Optical semiconductor sealing resin

• How To Read The Product Name
• About the Product Guidance
• Applications of the NT Series