Protection Tape Remover for Backgrinding Process
NEL SYSTEM®

This taping system automates the removal of the protection tape after backgrinding.

HR3000Ⅲ

Tape Remover for wafers up to 12"

• FOUP / Open cassette applicable
• Enhanced protection tape removal function
• User friendly touch panel
• User friendly parameter setting with recipe control
• Complies to safety regulation SEMI S2/S8
• UV irradiation function for protection tape removal (optional)
• Wafer mapping scanner (optional)
• SECS/GEM communication function (optional)

HR8500Ⅲ/HR8500ⅢTW

Tape Remover for wafers up to 8"

• User friendly touch panel
• User friendly parameter setting with recipe control
• Easy to replace consumable parts
• Complies to safety reglation SEMI S2/S8
• SECS/GEM communication function (optional)
• UV irradiation function (optional)
• Thin wafer (min. 50μm thick) compatible*

[Remarks]

*HR8500ⅢTW only.

HSA840

Semi-automatic Tape Remover for wafers up to 8"

• Wafer setting is done manually
• Tape removal and winding is done automatically