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Protection Tape Remover for Backgrinding Process
NEL SYSTEM®

HR8500-Ⅲ／HR8500-Ⅲ-TW
Fully Automatic Type Compatible with Wafers up to 8"
The system is equipped with a robot arm for wafer transportation, and a CCD-type noncontact aligner for wafer positioning to prevent dust production during transportation. The system can be operated easily by touch panel.

< Features >
  • Wafer transportation with robot arm
  • Non-contact wafer alignment using a CCD camera
  • User-friendly touch panel
  • Easy-to-replace consumable parts
  • Safety Regulation SEMI S2/S8 compliance
  • UV irradiating function for protection tape (optional)
  • SECS/GEM communication function (optional)
  • Compatible with thin wafers (min. 150µm thick) *1)
*1) HR8500-Ⅲ-TW only.
HSA840
Compact semi-automatic Type Tape Removal System
This is a semi-automatic, compact type protective ELEP HOLDER removal system. By changing the table, the system can accommodate wafer sizes of 4", 5", 6", and 8". Tape removal and residual tape rewinding are performed automatically simply by pressing the start button.

< Features >
  • Semi-automatic type with manual wafer setting and automatic tape application, cutting and waste tape removal
  • Electrostatic eliminator (optional)

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